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K4H561638F-UCC4

Samsung semiconductor
Part Number K4H561638F-UCC4
Manufacturer Samsung semiconductor
Description 256Mb F-die DDR400 SDRAM
Published Oct 10, 2005
Detailed Description DDR SDRAM 256Mb F-die (x8, x16) DDR SDRAM 256Mb F-die DDR400 SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compli...
Datasheet PDF File K4H561638F-UCC4 PDF File

K4H561638F-UCC4
K4H561638F-UCC4


Overview
DDR SDRAM 256Mb F-die (x8, x16) DDR SDRAM 256Mb F-die DDR400 SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) Revision 1.
1 Rev.
1.
1 August.
2003 DDR SDRAM 256Mb F-die (x8, x16) 256Mb F-die Revision History Revison 1.
0 (June.
2003) 1.
First release Revison 1.
1 (August.
2003) 1.
Added x8 org (K4H560838F) DDR SDRAM Rev.
1.
1 August.
2003 DDR SDRAM 256Mb F-die (x8, x16) Key Features • 200MHz Clock, 400Mbps data rate.
• VDD= +2.
6V + 0.
10V, VDDQ= +2.
6V + 0.
10V • Double-data-rate architecture; two data transfers per clock cycle • Bidirectional data strobe(DQS) • Four banks operation • Differential clock inputs(CK and CK) • DLL aligns DQ and DQS transition with CK transition • MRS cycle with address key programs -.
Read latency 3 (clock) for DDR400 , 2.
5 (clock) for DDR333 -.
Burst length (2, 4, 8) -.
Burst type (sequential & interleave) • All inputs except data & DM are sampled at the positive going edge of the system clock(CK) • Data I/O transactions on both edges of data ...



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