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RD38F1010xxxx

Intel Corporation
Part Number RD38F1010xxxx
Manufacturer Intel Corporation
Description (RD38Fxxxx) Flash Memory
Published Feb 23, 2006
Detailed Description m o .c ® U Intel Advanced+ Boot Block Flash 4 t e Memory (C3) e hSCSP Family S a t Datasheet a .D Product Features w w w...
Datasheet PDF File RD38F1010xxxx PDF File

RD38F1010xxxx
RD38F1010xxxx

Overview
m o .
c ® U Intel Advanced+ Boot Block Flash 4 t e Memory (C3) e hSCSP Family S a t Datasheet a .
D Product Features w w w m o .
c U 4 t e e h S a t a .
D w w w ■ ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity SCSP Technology — Smallest Memory Subsystem Footprint — Area : 8 x 10 mm for 16 Mbit (0.
13 µm) Flash + 2 Mbit or 4 Mbit SRAM — Area : 8 x 12 mm for 32 Mbit (0.
13 µm) Flash + 4 Mbit or 8 Mbit SRAM — Height : 1.
20 mm for 16 Mbit (0.
13 µm) Flash + 2 Mbit or 4 Mbit SRAM, and 32 Mbit (0.
13um) Flash + 8 Mbit SRAM — Height : 1.
40 mm for 32 Mbit (0.
13 µm) Flash + 4 Mbit SRAM — This Family also includes 0.
25 µm, 0.
18 µm, and 0.
13 µm technologies Advanced SRAM Technology — 70 ns Access Time — Low Power Operation — Low Voltage Data Retention Mode Intel® Flash Data Integrator (FDI) Software — Real-Time Data Storage and Code Execution in the Same Memory Device — Full Flash File Manager Capability ■ ■ ■ ■ Advanced+ Boot Block Flash Memory —70 ns Access Time —Instant, Individual Block Locking —128 bit Protection Register —12 V Production Programming —Fast Program and Erase Suspend —Extended Temperature –25 °C to +85 °C Blocking Architecture —Block Sizes for Code + Data Storage —4-Kword Parameter Blocks —64-Kbyte Main Blocks —100,000 Erase Cycles per Block Low Power Operation —Asynchronous Read Current: 9 mA (Flash) —Standby Current: 7 µA (Flash) —Automatic Power Saving Mode Flash Technologies —0.
25 µm ETOX™ VI, 0.
18 µm ETOX™ VII and 0.
13 µm ETOX™ VIII Flash Technologies The Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device delivers a feature-rich solution for low-power applications.
The C3 SCSP memory device incorporates flash memory and static RAM in one package with low voltage capability to achieve the smallest system memory solution form-factor together with high-speed, low-power operations.
The C3 SCSP memory device offers a protection register and flexible block locking to e...


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