Power Transistor NPN - Amp/Switch Transistor Chip
Description
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PROCESS
Power Transistor
CP211
Central
TM
NPN - Amp/Switch Transistor Chip
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 1,450 PRINCIPAL DEVICE TYPES 2N3054A DataSheet4U.com CJD41C TI...
Central Semiconductor
CP211 PDF File
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