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DIM200PHM33-F000
DIM200PHM33-F000
Half Bridge IGBT Module
Preliminary Information
DS5606-1.2 June 2003
FEATURES
I I I I
KEY PARAMETERS VCES VCE(sat) * IC IC(PK) (typ) (max) (max) 3300V 3.0V 200A 400A
Soft Punch Through Silicon 10µs Short Circuit Withstand Isolated MMC Base with AlN Substrates High Thermal Cycling Capability
* Measur...
