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MAS6180

Micro Analog systems
Part Number MAS6180
Manufacturer Micro Analog systems
Description AM Receiver IC
Published Mar 23, 2007
Detailed Description www.DataSheet4U.com DA6180.001 27 December, 2006 MAS6180 AM Receiver IC • • • • • • • • DESCRIPTION The MAS6180 AM-Rec...
Datasheet PDF File MAS6180 PDF File

MAS6180
MAS6180

Overview
www.
DataSheet4U.
com DA6180.
001 27 December, 2006 MAS6180 AM Receiver IC • • • • • • • • DESCRIPTION The MAS6180 AM-Receiver chip is a highly sensitive, simple to use AM receiver specially intended to receive time signals in the frequency range from 40 kHz to 100 kHz.
Only a few external components are required for time signal receiver.
The circuit has preamplifier, wide range automatic gain control, demodulator and output comparator built in.
The output signal can be processed directly by an additional digital circuitry to extract the data from the received signal.
The control for AGC (automatic gain control) can be used to switch AGC on or off if necessary.
MAS6180 has options for compensating shunt capacitances of different crystals (See ordering information on page 9).
Single Band Receiver IC High Sensitivity Very Low Power Consumption Wide Supply Voltage Range Power Down Control Control for AGC On High Selectivity by Crystal Filter Fast Startup Feature FEATURES • • • • • • • • • • • • Single Band Receiver IC Highly Sensitive AM Receiver, 0.
4 µVRMS typ.
Wide Supply Voltage Range from 1.
1 V to 3.
6 V Very Low Power Consumption Power Down Control Fast Startup Only a Few External Components Necessary Control for AGC On Wide Frequency Range from 40 kHz to 100 kHz High Selectivity by Quartz Crystal Filter Crystal Compensation Capacitance Options Differential Input APPLICATIONS • Single Band Time Signal Receiver WWVB (USA), JJY (Japan), DCF77 (Germany), MSF (UK), HGB (Switzerland) and BPC (China) BLOCK DIAGRAM VDD QOP QI QOM AON Demodulator & Comparator OUT RFIP VDD AGC Amplifier RFIM Power Supply/Biasing VDD VSS PDN AGC DEC 1 (9) DA6180.
001 27 December, 2006 MAS6180 PAD LAYOUT VSS pad bonded first! 1070 µm VDD QOP QOM QI AGC OUT VSS RFIM RFIP PDN AON DEC MAS6180Ax, x = 1, 2, 5 DIE size = 1.
07 mm x 1.
37 mm; PAD size = 80 µm x 80 µm Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left floatin...


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