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LH532100B-1

Sharp Electrionic Components
Part Number LH532100B-1
Manufacturer Sharp Electrionic Components
Description CMOS 2M (256K x 8) MROM
Published Mar 22, 2005
Detailed Description LH532100B-1 FEATURES • 262,144 words × 8 bit organization • Access time: 120 ns (MAX.) • Static operation • TTL compatib...
Datasheet PDF File LH532100B-1 PDF File

LH532100B-1
LH532100B-1



Overview
LH532100B-1 FEATURES • 262,144 words × 8 bit organization • Access time: 120 ns (MAX.
) • Static operation • TTL compatible I/O • Three-state outputs • Single +5 V power supply • Power consumption: Operating: 275 mW (MAX.
) Standby: 550 µW (MAX.
) • Mask-programmable control pin: Pin 1 = OE1/OE1/DC Pin 24 = OE/OE • Packages: 32-pin, 600-mil DIP 32-pin, 525-mil SOP 32-pin, 450-mil QFJ (PLCC) 32-pin, 8 × 20 mm2 TSOP (Type I) 32-pin, 400-mil TSOP (Type II) DESCRIPTION The LH532100B-1 is a CMOS 2M-bit mask-programmable ROM organized as 262,144 × 8 bits.
It is fabricated using silicon-gate process technology.
D7 CE A10 OE/OE A11 A9 A8 A13 A14 21 22 23 24 25 26 27 28 29 32-PIN DIP 32-PIN SOP OE1/OE1/DC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 D0 D1 D2 GND CMOS 2M (256K × 8) MROM PIN CONNECTIONS TOP VIEW 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC DC A17 A14 A13 A8 A9 A11 OE/OE A10 CE D7 D6 D5 D4 D3 532100B1-1 Figure 1.
Pin Connections for DIP and SOP Packages GND 32-PIN QFJ TOP VIEW D6 D5 D4 D3 D2 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 30 31 32 1 2 3 4 D0 A0 A1 A2 A3 A4 A5 A6 A7 VCC DC A16 A15 OE1/OE1/DC A17 A12 D1 532100B1-7 Figure 2.
Pin Connections for QFJ (PLCC) Package 1 LH532100B-1 CMOS 2M MROM 32-PIN TSOP (Type I) TOP VIEW 32-PIN TSOP (Type II) TOP VIEW A11 A9 A8 A13 A14 A17 DC VCC OE1/OE1/DC A16 A15 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE/OE A10 CE D7 D6 D5 D4 D3 GND D2 D1 D0 A0 A1 A2 A3 532100B1-2 OE1/OE1/DC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 D0 D1 D2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC DC A17 A14 A13 A8 A9 A11 OE/OE A10 CE D7 D6 D5 D4 D3 NOTE: Reverse bend available on request.
532100B1-3 Figure 3.
Pin Connections for TSOP (Type I) Package Figure 4.
Pin Connections for TSOP (Type II) Package 2 CMOS 2M MROM LH532100B-1 A17 30 A16 A15 A14 A13 2 3 29 2...



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