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CPQ165

TRIAC 25 Amp

Description

PROCESS www.DataSheet4U.com CPQ165 TRIAC 25 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 376 PRINCIPAL DEVICE TYPES CQDD-25M Series CQ220-25M Series CQ220-25MFP Series Glass Passivated Mesa 165 x 165 MILS 8...

Central Semiconductor

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