ADVANCE INFORMATION
General Physical Specification
WCMC2016V1X
128K x 16 Pseudo Static RAM DIE
Substrate Connection Req.: Ground Wafer Diameter [mm]: 200.00 Die Size [µm]: 4010.74 x 1565.84 Step Size [µm]: 4095.44 x 1650.89 Scribe Size [µm]: 84.70 x 84.94 Pad Count: 64 Pad Size [µm]: 73.6 x 73.6
For product parameters and availability, please refer to the...
