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W3H32M64E-XSBX

Part Number	W3H32M64E-XSBX
Manufacturer	White Electronic Designs
Description	32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
Published	Apr 30, 2010
Detailed Description	White Electronic Designs W3H32M64E-XSBX ADVANCED* www.DataSheet4U.com 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package ...
Datasheet	W3H32M64E-XSBX PDF File

Overview

White Electronic Designs W3H32M64E-XSBX ADVANCED* www.
DataSheet4U.
com 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Package: • 208 Plastic Ball Grid Array (PBGA), 16 x 20mm • 1.
0mm pitch DDR2 Data Rate = 667*, 533, 400 Supply Voltage = 1.
8V ± 0.
1V Differential data strobe (DQS, DQS#) per byte Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS transitions with clock signal Four internal banks for concurrent operation (Per DDR2 SDRAM Die) Programmable Burst lengths: 4 or 8 Auto Refresh and Self Refresh Modes On Die Termination (ODT) Adjustable data – output drive strength Programmable CAS latenc...

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W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package - White Electronic Designs

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