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SI5476DU

Vishay Siliconix
Part Number SI5476DU
Manufacturer Vishay Siliconix
Description N-Channel MOSFET
Published Jan 20, 2012
Detailed Description New Product N-Channel 60-V (D-S) MOSFET Si5476DU Vishay Siliconix PRODUCT SUMMARY VDS (V) 60 RDS(on) (Ω) 0.034 at VG...
Datasheet PDF File SI5476DU PDF File

SI5476DU
SI5476DU

Overview
New Product N-Channel 60-V (D-S) MOSFET Si5476DU Vishay Siliconix PRODUCT SUMMARY VDS (V) 60 RDS(on) (Ω) 0.
034 at VGS = 10 V 0.
041 at VGS = 4.
5 V PowerPAK ChipFET Single ID (A)a 12 12 Qg (Typ.
) 10.
5 nC 1 2 Marking Code D3 DD 4 8D 7D 6S D G S AA XXX Lot Traceability and Date Code Part # Code 5 FEATURES • Halogen-free • TrenchFET® Power MOSFET • New Thermally Enhanced PowerPAK® ChipFET® Package - Small Footprint Area - Low On-Resistance - Thin 0.
8 mm Profile APPLICATIONS • Load Switch for Portable Applications • DC-DC Switch for Low Power Synchronous Rectification • Intermediate Switch Driver for DC/DC Applications G RoHS COMPLIANT D Bottom View S Ordering Information: Si5476DU-T1-GE3 (Lead (Pb)-free and Halogen-free) N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Drain-Source Voltage Gate-Source Voltage VDS VGS Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current Continuous Source-Drain Diode Current Avalanche Current Single Pulse Avalanche Energy TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C TC = 25 °C TA = 25 °C L = 0.
1 mH ID IDM IS IAS EAS Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C PD TJ, Tstg Limit 60 ± 20 12a 12a 7b, c 5.
6b, c 25 12a 2.
6b, c 15 11.
2 31 20 3.
1b, c 2b, c - 55 to 150 260 Unit V A mJ W °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, f Maximum Junction-to-Case (Drain) t≤5s Steady State RthJA RthJC 34 3 40 °C/W 4 Notes: a.
Package limited.
b.
Surface Mounted on 1" x 1" FR4 board.
c.
t = 5 s.
d.
See Solder Profile (http://www.
vishay.
com/ppg?73257).
The PowerPAK ChipFET is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is n...


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