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BC858ALT1G

ON Semiconductor
Part Number BC858ALT1G
Manufacturer ON Semiconductor
Description General Purpose Transistors
Published Oct 25, 2014
Detailed Description BC856ALT1G Series General Purpose Transistors PNP Silicon Features http://onsemi.com • S and NSV Prefix for Automotive ...
Datasheet PDF File BC858ALT1G PDF File

BC858ALT1G
BC858ALT1G

Overview
BC856ALT1G Series General Purpose Transistors PNP Silicon Features http://onsemi.
com • S and NSV Prefix for Automotive and Other Applications Requiring • Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant COLLECTOR 3 1 BASE 2 EMITTER MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Collector-Emitter Voltage BC856, SBC856 BC857, SBC857 BC858, NSVBC858, BC859 Collector-Base Voltage BC856, SBC856 BC857, SBC857 BC858, NSVBC858, BC859 Emitter−Base Voltage Collector Current − Continuous Collector Current − Peak Symbol VCEO −65 −45 −30 VCBO −80 −50 −30 VEBO IC IC −5.
0 −100 −200 V mAdc mAdc xx M G G Max 225 1.
8 RqJA PD 300 2.
4 RqJA TJ, Tstg 417 −55 to +150 mW mW/°C °C/W 556 Unit mW mW/°C °C/W xx M G 1 = Device Code xx = (Refer to page 6) = Date Code* = Pb−Free Package V Value Unit V 1 2 SOT−23 (TO−236AB) CASE 318 STYLE 6 3 MARKING DIAGRAM THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR− 5 Board, (Note 1) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Total Device Dissipation Alumina Substrate, (Note 2) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Symbol PD (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location.
ORDERING INFORMATION °C See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device.
Maximum Ratings are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.
FR−5 = 1.
0 x 0.
75 x 0.
062 in.
2.
Alumina = 0.
4 x 0.
3 x 0.
024 in 99.
5% alumina.
© Semiconductor Components Industries, LLC, 2014 1 March, 2014 − Rev.
14 Publication Or...


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