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BL2012-10B2450

Advanced Ceramic X
Part Number BL2012-10B2450
Manufacturer Advanced Ceramic X
Description Multilayer Chip Baluns
Published Jan 19, 2015
Detailed Description BL 2012 Series Multilayer Chip Baluns ACX Advanced Ceramic X Features  Monolithic SMD with small, low-profile and lig...
Datasheet PDF File BL2012-10B2450 PDF File

BL2012-10B2450
BL2012-10B2450

Overview
BL 2012 Series Multilayer Chip Baluns ACX Advanced Ceramic X Features  Monolithic SMD with small, low-profile and light-weight type.
Applications 0.
8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc.
Specifications Frequency Unbalanced Balanced Insertion Part Number Range Impedance Impedance Loss (MHz) (ohm) (ohm) (dB) VSWR @BW Phase Amplitude Difference Difference (degree) (dB) BL201210B2450_ 2400 ~ 2500 50 100 1.
0 max.
2.
0 max.
180  10 2 max.
Q’ty/Reel (pcs) Operating Temperature Range Storage Temperature Range Storage Period Power Capacity Part Number : 4000 : -40 ~ +85 oC : -40 ~ +85 oC : 12 months max.
: 2W max.
BL 2012 - 10 B   2450  /LF    Type BL : Balun  Dimensions ( L × W ) 2.
0 × 1.
25 mm  Balanced Impedance  Central Frequency  Soldering 10 : 100 ohm  Specification Code 2450 : 2450MHz  Packaging =lead-containing /LF=lead-free B T: Tape & Reel B: Bulk Te...


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