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ESD7481MUT5G

ON Semiconductor
Part Number ESD7481MUT5G
Manufacturer ON Semiconductor
Description ESD Protection Diode
Published Jul 31, 2015
Detailed Description ESD7481, SZESD7481 ESD Protection Diodes Micro−Packaged Diodes for ESD Protection The ESD7481 is designed to protect v...
Datasheet PDF File ESD7481MUT5G PDF File

ESD7481MUT5G
ESD7481MUT5G

Overview
ESD7481, SZESD7481 ESD Protection Diodes Micro−Packaged Diodes for ESD Protection The ESD7481 is designed to protect voltage sensitive components that require ultra−low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium.
Because of its low capacitance, the part is well suited for use in high frequency designs such as USB 2.
0 high speed and antenna line applications.
Features • Ultra−Low Capacitance 0.
25 pF • Low Clamping Voltage • Small Body Outline Dimensions: 0.
60 mm x 0.
30 mm • Low Body Height: 0.
3 mm • Stand−off Voltage: 3.
3 V • Low Leakage • Insertion Loss: 0.
030 dBm • Response Time is < 1 ns • Low Dynamic Resistance < 1 W • IEC61000−4−2 Level 4 ESD Protection • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications • RF Signal ESD Protection • RF Switching, PA, and Antenna ESD Protection • Near Field Communications www.
onsemi.
com 1 Cathode 2 Anode X3DFN2 CASE 152AF MARKING DIAGRAM PIN 1 FM F = Specific Device Code M = Date Code ORDERING INFORMATION Device Package Shipping† ESD7481MUT5G X3DFN2 15000 / Tape & (Pb−Free) Reel SZESD7481MUT5G X3DFN2 15000 / Tape & (Pb−Free) Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact Air ±20 kV ±20 Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) °PD° RqJA TJ, Tstg TL 250 mW 400 °C/W −40 to +125 °C 260 °C Stresses exc...


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