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NTMD6N04

ON Semiconductor
Part Number NTMD6N04
Manufacturer ON Semiconductor
Description Power MOSFET
Published Aug 20, 2015
Detailed Description NTMD6N04, NVMD6N04 Power MOSFET 40 V, 5.8 A, Dual N−Channel SOIC−8 Features • Designed for use in low voltage, high spe...
Datasheet PDF File NTMD6N04 PDF File

NTMD6N04
NTMD6N04

Overview
NTMD6N04, NVMD6N04 Power MOSFET 40 V, 5.
8 A, Dual N−Channel SOIC−8 Features • Designed for use in low voltage, high speed switching applications • Ultra Low On−Resistance Provides Higher Efficiency and Extends Battery Life − RDS(on) = 0.
027 W, VGS = 10 V (Typ) − RDS(on) = 0.
034 W, VGS = 4.
5 V (Typ) • Miniature SOIC−8 Surface Mount Package Saves Board Space • Diode is Characterized for Use in Bridge Circuits • Diode Exhibits High Speed, with Soft Recovery • NVMD Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* • These Devices are Pb−Free and are RoHS Compliant Applications • DC−DC Converters • Computers • Printers • Cellular and Cordless Phones • Disk Drives and Tape Drives MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Drain−to−Source Voltage Gate−to−Source Voltage − Continuous Drain Current (Note 1) − Continuous @ TA = 25°C − Single Pulse (tp ≤ 10 ms) Drain Current (Note 2) − Continuous @ TA = 25°C Total Power Dissipation @ TA = 25°C (Note 1) @ TA = 25°C (Note 2) Operating and Storage Temperature Range VDSS VGS ID IDM ID 40 "20 5.
8 29 4.
6 V V Adc Apk Adc PD TJ, Tstg 2.
0 1.
29 −55 to +150 W °C Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 40 Vdc, VGS = 5.
0 Vdc, Vdc, Peak IL = 7.
0 Apk, L = 10 mH, RG = 25 W) Thermal Resistance − Junction−to−Ambient (Note 1) − Junction−to−Ambient (Note 2) EAS RqJA 245 mJ °C/W 62.
5 97 Maximum Lead Temperature for Soldering Purposes for 10 Sec TL 260 °C Stresses exceeding Maximum Ratings may damage the device.
Maximum Ratings are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.
When surface mounted to an FR4 board using 1″ pad size, t ≤ 10 s 2.
When surface mounted to an FR4 board using 1″ pad size, t = steady state http...


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