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Si5485DU

Vishay
Part Number Si5485DU
Manufacturer Vishay
Description P-Channel MOSFET
Published Dec 18, 2015
Detailed Description P-Channel 20-V (D-S) MOSFET Si5485DU Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 0.025 at VGS = - 4.5 V - ...
Datasheet PDF File Si5485DU PDF File

Si5485DU
Si5485DU


Overview
P-Channel 20-V (D-S) MOSFET Si5485DU Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 0.
025 at VGS = - 4.
5 V - 20 0.
042 at VGS = - 2.
5 V ID (A) - 12a - 12a Qg (Typ.
) 14 nC FEATURES • Halogen-free • TrenchFET® Power MOSFET • New Thermally Enhanced PowerPAK® ChipFET® Package - Small Footprint Area - Low On-Resistance - Thin 0.
8 mm profile RoHS COMPLIANT PowerPAK ChipFET Single APPLICATIONS 1 2 D3 DD 4 8D 7D 6S D G S 5 • Load Switch, Battery Switch, PA Switch and Charger Switch S Marking Code BE XXX G Lot Traceability and Date Code Bottom View Part # Code D Ordering Information: Si5485DU-T1-GE3 (Lead (Pb)-free and Halogen-free) P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e VDS VGS ID IDM IS PD TJ, Tstg Limit - 20 ± 12 - 12a - 12a - 8.
8b, c - 7.
1b, c - 30 - 12 - 2.
6b, c 31 20 3.
1b, c 2b, c - 55 to 150 260 Unit V A W °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, f Maximum Junction-to-Case (Drain) t≤5s Steady State RthJA RthJC 34 3 40 °C/W 4 Notes: a.
Package limited.
b.
Surface Mounted on 1" x 1" FR4 board.
c.
t = 5 s.
d.
See Solder Profile (http://www.
vishay.
com/ppg?73257).
The PowerPAK ChipFET is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework Conditions: manual soldering with a soldering iron is not recommended...



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