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MT5C1001

Part Number MT5C1001
Manufacturer Micron
Title 1 Meg x 1 SRAM
Description The MT5C1001 is organized as a 1,048,576 x 1 SRAM using a four-transistor m...
Features
• High speed: 12,15,17,20,25 and 35
• High-performance, low-power, CMOS double-metal process
• Single +5V ±1O% power supply
• Easy memory expansion with CE option
• All inputs and outputs are TIL-compatible OPTIONS
• Timing 12ns access 15ns access 17ns access 20ns access 25ns access 35ns access MA...

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MT5C1001 : The MT5C1001 employs low power, high-performance silicon-gate CMOS technology. Static design eliminates the need for external clocks or timing strobes while CMOS circuitry reduces power consumption and provides for greater reliability. For flexibility in high-speed memory applications, ASI offers chip enable (CE\) and output enable (OE\) capability. These enhancements can place the outputs in High-Z for additional flexibility in system design. Writing to these devices is accomplished when write enable (WE|) and CE\ inputs are both LOW. Reading is accomplished when WE\ remains HIGH while CE\ and OE\ go LOW. The devices offer a reduced power standby mode when disabled. This allows system desig.

MT5C1001 : The MT5C1001 employs low power, high-performance silicon-gate CMOS technology. Static design eliminates the need for external clocks or timing strobes while CMOS circuitry reduces power consumption and provides for greater reliability. For flexibility in high-speed memory applications, Micross offers chip enable (CE\) and output enable (OE\) capability. These enhancements can place the outputs in High-Z for additional flexibility in system design. Writing to these devices is accomplished when write enable (WE|) and CE\ inputs are both LOW. Reading is accomplished when WE\ remains HIGH while CE\ and OE\ go LOW. The devices offer a reduced power standby mode when disabled. This allows system des.

MT5C1005 : The Austin Semiconductor SRAM family employs high-speed, low power CMOS designs fabricated using doublelayer metal, double-layer polysilicon technology. For flexibility in high-speed memory applications, ASI offers chip enable (CE\) and output enable (OE\) capability. These enhancements can place the outputs in High-Z for additional flexibility in system design. Writing to these devices is accomplished when write enable (WE\) and CE\ inputs are both LOW. Reading is accomplished when WE\ remains HIGH while CE\ and OE\ go LOW. The devices offer a reduced power standby mode when disabled. This allows system designs to achieve low standby power requirements. All devices operation from a single +.

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MT5C1009 : SRAM MT5C1009 128K x 8 SRAM WITH CHIP & OUTPUT ENABLE AVAILABLE AS MILITARY SPECIFICATIONS •SMD 5962-89598 •MIL-STD-883 FEATURES • Access Times: 12, 15, 20, 25, 35, 45, 55 and 70 ns • Battery Backup: 2V data retention • Low power standby • High-performance, low-power CMOS process • Single +5V (+10%) Power Supply • Easy memory expansion with CE\ and OE\ options. • All inputs and outputs are TTL compatible OPTIONS • Timing 12ns access 15ns access 20ns access 25ns access 35ns access 45ns access 55ns access 70ns access MARKING -12 (IT only) -15 -20 -25 -35 -45 -55* -70* • Package(s)• Ceramic DIP (400 mil) Ceramic DIP (600 mil) Ceramic LCC Ceramic LCC Ceramic Flatpack Ceramic SOJ Ceramic SOJ .




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