Part Number
|
BYG50M |
Manufacturer
|
NXP |
Description
|
Controlled avalanche rectifiers |
Published
|
Mar 23, 2005 |
Detailed Description
|
DISCRETE SEMICONDUCTORS
DATA SHEET
ok, halfpage
M3D168
BYG50 series Controlled avalanche rectifiers
Preliminary speci...
|
Datasheet
|
BYG50M
|
Overview
DISCRETE SEMICONDUCTORS
DATA SHEET
ok, halfpage
M3D168
BYG50 series Controlled avalanche rectifiers
Preliminary specification 1996 May 24
Philips Semiconductors
Preliminary specification
Controlled avalanche rectifiers
FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • UL 94V-O classified plastic package • Shipped in 12 mm embossed tape.
Top view Side view
handbook, 4 columns
BYG50 series
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
DESCRIPTION DO-214AC; SOD106 surface mountable package with glass passivated chip.
cathode band k a
MSA474
...
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