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BYG50D

NXP
Part Number BYG50D
Manufacturer NXP
Description Controlled avalanche rectifiers
Published Mar 23, 2005
Detailed Description DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D168 BYG50 series Controlled avalanche rectifiers Preliminary speci...
Datasheet PDF File BYG50D PDF File

BYG50D
BYG50D

Overview
DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D168 BYG50 series Controlled avalanche rectifiers Preliminary specification 1996 May 24 Philips Semiconductors Preliminary specification Controlled avalanche rectifiers FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • UL 94V-O classified plastic package • Shipped in 12 mm embossed tape.
Top view Side view handbook, 4 columns BYG50 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
DESCRIPTION DO-214AC; SOD106 surface mountable package with glass passivated chip.
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