DIE DATA SHEET www.
onsemi.
com Field Stop Trench IGBT Die 750 V, 200 A PCGLA200T75NF8 VCES = 750 V IC = Limited by Tj(max) IGBT DIE Features • AEC−Q101 Rev.
D Qualified for Enhanced Reliability • Maximum Junction Temperature 175°C • Advanced FS4 Trench Technology • Positive Temperature Coefficient • Easy Paralleling • Short Circuit Rated • Very Low Saturation Voltage: VCE(SAT) = 1.
45 V(Typ.
) @ IC = 200 A • Optimized for Motor Control Applications Applications • Automotive Traction Modules • General Power Modules DIE OUTLINE MECHANICAL PARAMETERS Parameter Mils mm Die Size 394 x 394 10,000 x 10,000 Emitter Pad Size See chip drawing See chip drawing Gate Pad Size 47 x 56 1,200 ...

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