Part Number
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SIGC08T60 |
Manufacturer
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Infineon Technologies |
Description
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IGBT |
Published
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Sep 15, 2007 |
Detailed Description
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com
SIGC08T60
IGBT Chip
FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off l...
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Datasheet
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SIGC08T60
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Overview
com
SIGC08T60
IGBT Chip
FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling
3
This chip is used for: • power module • discrete components Applications: • drives • white goods • resonant applications
C
G
E
Chip Type SIGC08T60
VCE 600V
ICn 15A
Die Size 2.
86 x 2.
82 mm2
Package sawn on foil
Ordering Code Q67050A4282-A101
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject i...
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