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SIGC08T60

Infineon Technologies
Part Number SIGC08T60
Manufacturer Infineon Technologies
Description IGBT
Published Sep 15, 2007
Detailed Description www.DataSheet4U.com SIGC08T60 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off l...
Datasheet PDF File SIGC08T60 PDF File

SIGC08T60
SIGC08T60

Overview
www.
DataSheet4U.
com SIGC08T60 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling 3 This chip is used for: • power module • discrete components Applications: • drives • white goods • resonant applications C G E Chip Type SIGC08T60 VCE 600V ICn 15A Die Size 2.
86 x 2.
82 mm2 Package sawn on foil Ordering Code Q67050A4282-A101 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject i...


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