Part Number
|
FBGA-SD |
Manufacturer
|
STATS ChipPAC |
Description
|
Fine Pitch Ball Grid Array |
Published
|
Oct 17, 2007 |
Detailed Description
|
com
FBGA-SD
Fine Pitch Ball Grid Array - Stacked Die
• FBGA-SD: Laminate substrate based enabling 2 & 4...
|
Datasheet
|
FBGA-SD
|
Overview
com
FBGA-SD
Fine Pitch Ball Grid Array - Stacked Die
• FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility • FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance • Available in 1.
4mm (LFBGA-SD), 1.
2mm (TFBGASD/TFBGA-T-SD), 1.
0mm (VFBGA-SD/VFBGA-TSD) & 0.
80mm (WFBGA-SD) maximum package thickness • Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution
FEATURES
• 2 die to 7 die stack with spacer capability • 5 x 5mm to 23 x 23mm body size • Package height at 1.
0, 1.
2, 1.
4 and 1.
7mm max.
• Flexible die stacking options (“pyramid,” “same die,” etc.
)...
Similar Datasheet