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com UH1B, UH1C & UH1D Vishay General Semiconductor Surface Mount Ultrafast Rectifiers FEATURES • Low profile package • Ideal for automated placement • Oxide planar chip junction • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C DO-214AC (SMA) • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF at IF = 1.
0 A TJ max.
1.
0 A 100 V, 150 V, 200 V 30 A 25 ns 0.
76 V 175 °C TYPICAL APPLICATIONS For use in secondary rectification and freewheeling for ultrafast switching speeds ac-to-ac and dc-to-dc converters in high temperatu...

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