com Preliminary SIDC81D120F6 Fast switching diode chip in EMCON-Technology FEATURES: • 1200V EMCON technology 120 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient A This chip is used for: • EUPEC power modules and discrete devices Applications: • SMPS, resonant applications, drives C Chip Type SIDC81D120F6 VR IF Die Size 9 x 9 mm2 Package sawn on foil Ordering Code Q67050-A4187A001 1200V 100A MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Anode metallisation Cathode metallisation Die bond Wire bond Reject Ink Dot ...

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