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CP314

Small Signal Transistor NPN - High Current Transistor Chip

Description

Central TM PROCESS CP314 Semiconductor Corp. Small Signal Transistor NPN - High Current Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 6,936 PRINCIPAL DEVICE TYPES CBCP68 CBCX68 CZT651 MPS650 MPS651 EPITAXIAL P...

Central Semiconductor

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