Part Number
|
IGC168T170S8RM |
Manufacturer
|
Infineon |
Description
|
IGBT |
Published
|
Feb 7, 2016 |
Detailed Description
|
IGC168T170S8RM
IGBT3 Power Chip
Features: 1700V Trench + Field stop technology low switching losses soft turn off...
|
Datasheet
|
IGC168T170S8RM
|
Overview
IGC168T170S8RM
IGBT3 Power Chip
Features: 1700V Trench + Field stop technology low switching losses soft turn off positive temperature coefficient easy paralleling
This chip is used for: power modules
Applications: drives
Chip Type
VCE
IC
Die Size
IGC168T170S8RM 1700V 150A 13.
38 x 12.
58 mm2
C
G E
Package sawn on foil
Mechanical Parameters Raster size Emitter pad size (incl.
gate pad) Gate pad size Area total Thickness Wafer size Max.
possible chips per wafer Passivation frontside Pad metal
Backside metal
Die bond Wire bond Reject ink dot size
Recommended storage environment
13.
38 x 12.
58
11.
159 x 10.
353 1.
674 x 0.
899
mm2
168.
3
190 µm
200 mm
150
Photoimide
3200 ...
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