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Part Number
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CP317 |
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Manufacturer
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Central Semiconductor |
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Description
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Small Signal Transistor NPN - RF Transistor Chip |
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Published
|
Apr 1, 2011 |
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Detailed Description
|
PROCESS
Small Signal Transistor
NPN - RF Transistor Chip
CP317
PROCESS DETAILS Process Die Size Die Thickness Base Bo...
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|
Datasheet
|
CP317
|
Overview
PROCESS
Small Signal Transistor
NPN - RF Transistor Chip
CP317
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 53,788 PRINCIPAL DEVICE TYPES CMPT918 2N918 2N2857 2N5179 2N5770 BFY90 PN3563 PN3564
BACKSIDE COLLECTOR
EPITAXIAL PLANAR 14.
5 x 14.
5 MILS 9.
0 MILS 2.
4 x 2.
2 MILS 2.
4 x 2.
2 MILS Al - 30,000Å Au - 18,000Å
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PROCESS
CP317
Typical Electrical Characteristics
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