Part Number
|
SIGC109T120R3 |
Manufacturer
|
Infineon Technologies |
Description
|
IGBT |
Published
|
Sep 15, 2007 |
Detailed Description
|
www.DataSheet4U.com
Preliminary
SIGC109T120R3
IGBT Chip
FEATURES: • 1200V Trench + Field Stop technology • low turn-of...
|
Datasheet
|
SIGC109T120R3
|
Overview
www.
DataSheet4U.
com
Preliminary
SIGC109T120R3
IGBT Chip
FEATURES: • 1200V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling
3
This chip is used for: • power module
C
Applications: • drives
G
E
Chip Type SIGC109T120R3
VCE
ICn
Die Size 10.
47 x 10.
44 mm2
Package sawn on foil
Ordering Code Q67050A4108-A001
1200V 100A
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 10.
4...
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