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TMPC1265HP-R47MG-D

TAI-TECH
Part Number TMPC1265HP-R47MG-D
Manufacturer TAI-TECH
Description SMD Power Choke Coil
Published May 10, 2016
Detailed Description B E H SMD Power Choke Coil 1. Features 1. Carbonyl Powder inductor. 2. Compact design. 3. High current，low DCR，high ef...
Datasheet PDF File TMPC1265HP-R47MG-D PDF File

TMPC1265HP-R47MG-D
TMPC1265HP-R47MG-D

Overview
B E H SMD Power Choke Coil 1.
Features 1.
Carbonyl Powder inductor.
2.
Compact design.
3.
High current，low DCR，high efficiency.
4.
Very low acoustic noise and very low leakage flux noise.
5.
High reliability.
6.
100% Lead(Pb) & Halogen-Free and RoHS compliant.
2.
Applications Note PC power system，incl.
IMVP-6 DC/DC converter.
3.
Dimensions AC D Dr.
MOS application 　14RR70 11220015 TMPC1265HP-Series(G)-D Halogen Halogen-free Pb Pb-free Recommend PC Board Pattern L L(mm) 14.
2 G(mm) 8.
0 G H(mm) 5.
0 Series A(mm) B(mm) C(mm) D(mm) E(mm) TMPC1265HP 13.
5±0.
5 12.
5±0.
3 6.
2±0.
3 2.
3±0.
3 4.
7±0.
3 4.
Part Numbering TMPC 1265 HP - A BC 1R0 D MG - D EF A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F D/C 5.
Specification BxC H: Carbonyl Powder；P: PAD broaden 1R0=1.
0uH M=±20% :.
1R0 D/C 1205 (D/C ,,) Part Number TMPC1265HP-R15MG-D TMPC1265HP-R22MG-D TMPC1265HP-R30MG-D TMPC1265HP-R33MG-D TMPC1265HP-R36MG-D TMPC1265HP-R40MG-D TMPC1265HP-R47MG-D TMPC1265HP-R50MG-D Inductance L0 (uH)±20% @ 0 A 0.
15 0.
22 0.
30 0.
33 0.
36 0.
40 0.
47 0.
50 I rms (A) typ.
55 53 48 46 45 44 41 40 I sat (A) typ.
118 112 72 68 66 64 63 60 DCR DCR (mΩ) typ.
@25℃ (mΩ) max.
@25℃ 0.
49 0.
47 0.
6 0.
65 0.
7 0.
7 0.
9 0.
92 0.
60 0.
60 0.
72 0.
8 0.
9 1.
0 1.
2 1.
25 Note: 1.
Test frequency : L : 100KHz /1.
0V 2.
All test data referenced to 25℃ ambient.
3.
Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4.
Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt≦40℃ (keep 1min.
).
5.
Saturation Current (Isat 1) will cause L0 to drop ≦ 20% typical.
(keep quickly).
6.
The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.
Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature.
Part temperature should be verified in the end application.
7.
Special inquiries besides the above co...


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