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MAGX-000035-01000P

MA-COM
Part Number MAGX-000035-01000P
Manufacturer MA-COM
Description Pulsed Transistor
Published May 27, 2016
Detailed Description MAGX-000035-01000P GaN Wideband 10 W CW / Pulsed Transistor in Plastic Package DC - 3.5 GHz Rev. V2 Features  GaN on...
Datasheet PDF File MAGX-000035-01000P PDF File

MAGX-000035-01000P
MAGX-000035-01000P

Overview
MAGX-000035-01000P GaN Wideband 10 W CW / Pulsed Transistor in Plastic Package DC - 3.
5 GHz Rev.
V2 Features  GaN on SiC D-Mode Transistor Technology  Unmatched, Ideal for Pulsed / CW Applications  50 V Typical Bias, Class AB  Common-Source Configuration  Thermally-Enhanced 3 x 6 mm 14-Lead DFN  MTTF = 600 years (TJ < 200°C)  Halogen-Free “Green” Mold Compound  RoHS* Compliant and 260°C Reflow Compatible  MSL-1 Description The MAGX-000035-01000P is a GaN on SiC unmatched power device offering the widest RF frequency capability, most reliable high voltage operation, lowest overall power transistor size, cost and weight in a “TRUE SMT” plastic-packaging technology.
Use of an internal stress buffer technology allows reliable operation at junction temperatures up to 200°C.
The small package size and excellent RF performance make it an ideal replacement for costly flanged or metal-backed module components.
Ordering Information1,2 Part Number Package Functional Schematic 12 34 56 7 NC NC G NC NC GG 15 D NC NC D D NC NC MAGX-000035-01000P Bulk Packaging 14 13 12 11 10 9 8 MAGX-000035-0100TP 500 Piece Reel MAGX-000035-PB4PPR Sample Board 1.
Reference Application Note M513 for reel size information.
2.
When ordering sample evaluation boards, choose a standard frequency range indicated on page 4/5 or specify a desired custom range.
Custom requests may increase lead times.
Pin Configuration3 Pin No.
Function 1 No Connection 2 No Connection 3 VGG/RFIN 4 VGG/RFIN 5 VGG/RFIN 6 No Connection Pin No.
8 9 10 11 12 13 Function No Connection No Connection VDD/RFOUT VDD/RFOUT VDD/RFOUT No Connection * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
7 No Connection 14 No Connection 15 Paddle4 3.
MACOM recommends connecting unused package pins to ground.
4.
The exposed pad centered on the package bottom must be connected to RF and DC ground.
1 M/A-COM Technology Solutions Inc.
(MACOM) and its affiliates reserve the right to ...


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