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28F400B3

Intel
Part Number 28F400B3
Manufacturer Intel
Description 3 Volt Advanced Boot Block Flash Memory
Published Jun 3, 2016
Detailed Description 3 Volt Advanced Boot Block Flash Memory 28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Preliminary Datashe...
Datasheet PDF File 28F400B3 PDF File

28F400B3
28F400B3

Overview
3 Volt Advanced Boot Block Flash Memory 28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Preliminary Datasheet Product Features s Flexible SmartVoltage Technology — 2.
7 V–3.
6 V Read/Program/Erase — 12 V VPP Fast Production Programming s 2.
7 V or 1.
65 V I/O Option — Reduces Overall System Power s High Performance — 2.
7 V–3.
6 V: 70 ns Max Access Time s Optimized Block Sizes — Eight 8-KB Blocks for Data,Top or Bottom Locations — Up to One Hundred Twenty-Seven 64KB Blocks for Code s Block Locking — VCC-Level Control through WP# s Low Power Consumption — 9 mA Typical Read Current s Absolute Hardware-Protection — VPP = GND Option — VCC Lockout Voltage s Extended Temperature Operation — –40 °C to +85 °C s Automated Program and Block Erase — Status Registers s Intel® Flash Data Integrator Software — Flash Memory Manager — System Interrupt Manager — Supports Parameter Storage, Streaming Data (e.
g.
, Voice) s Extended Cycling Capability — Minimum 100,000 Block Erase Cycles Guaranteed s Automatic Power Savings Feature — Typical ICCS after Bus Inactivity s Standard Surface Mount Packaging — 48-Ball CSP Packages — 40- and 48-Lead TSOP Packages s Density and Footprint Upgradeable for common package — 4-, 8-, 16-, 32- and 64-Mbit Densities s ETOX™ VII (0.
18 µ) Flash Technology — 28F160/320/640B3xC — 4-, 8-, 16-, and 32-Mbit also exist on ETOX™ V (0.
4µ) and/or ETOX ™ VI (0.
25µ) Flash Technology s x8 not recommended for new designs s 4-Mbit density not recommended for new designs The 3 Volt Advanced Boot Block flash memory, manufactured on Intel’s latest 0.
18 µm technology, represents a feature-rich solution at overall lower system cost.
The 3 Volt Advanced Boot Block flash memory products in x16 will be available in 48-lead TSOP and 48-ball CSP packages.
The x8 option of this product family will only be available in 40-lead TSOP and 48ball µBGA* packages.
Additional information on this product family can be obtained by accessing Intel’s website at: http://www.
intel.
co...


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