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CHFP6KE11A

Part Number	CHFP6KE11A
Manufacturer	Microsemi Corporation
Description	Patented Flip-Chip Series
Published	Mar 23, 2005
Detailed Description	8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503 FLIP-CHIP TVS DIODES CHFP6KE5.0 thru ...
Datasheet	CHFP6KE11A PDF File

Overview

8700 E.
Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503 FLIP-CHIP TVS DIODES CHFP6KE5.
0 thru CHFP6KE170CA FEATURES • • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot Patented Flip-Chip Series MAXIMUM RATINGS • • • • • • • Max Junction Temperature: 1500C (with conformal coating) Storage Temperature: -550C to +1500C Flip-Chip Peak Pulse Power: 600 Watts (10/1000 µ s) Maximum non-repetitive peak power 600 Watts (10/1000 µ s) Total continuous power dissipation 2.
5 W (with adequate heat sink @ 750C) Turn-on time (theoretical) unidirectional 1X10-12 Turn-on time (theoretical) bidirectional 1X10-9 MECHANICAL • Weight: 0.
01 grams (approximate) • • Solderable standoff tabs .
040X.
040X.
010 Waffle package 50 pices or wafer ring 70 pieces PACKAGING BIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT UNIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT VBR above 30 V VBR 30V and below MSC1596.
PDF ISO 9001 CERTIFIED REV B 3/13/2000 CHFP6KE5.
0 thru CHFP6KE170CA PEAK PULSE POWER Vs PULSE TIME Ppp – PEAK PULSE POWER – kW PEAK PULSE POWER DERATING TP – PULSE TIME – SEC TEMPERATURE °C ATTACHMENT AND CONFORMAL COATING INSTRUCTIONS FOR Flip-Chip COMPONENTS The .
010” thick tab standoffs minimize shorting during attachment; however, minimal solder/conductive epoxy must be used and carefully controlled to prevent excess attachment material from wicking up the side of the tab and shorting across the junction.
Maximum recommended solder temperatures are 212 C for IR reflow and 221 C for vapor-phase reflow.
For flip-chip protection, coating material is Stycast ™ 2651-40 lowviscosity epoxy manufactured by Emerson & Cuming.
Follow instructions carefully for preparation of the epoxy to prevent entrapment of air bubbles.
Make sure that Flip-Chips have been baked at 100 C for...

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