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CMS20I30A

Toshiba
Part Number CMS20I30A
Manufacturer Toshiba
Description Schottky Barrier Diode
Published Aug 1, 2016
Detailed Description Schottky Barrier Diode CMS20I30A 1. Applications • Secondary Rectification in Switching Regulators • Reverse-Current Pro...
Datasheet PDF File CMS20I30A PDF File

CMS20I30A
CMS20I30A

Overview
Schottky Barrier Diode CMS20I30A 1.
Applications • Secondary Rectification in Switching Regulators • Reverse-Current Protection in Mobile Devices 2.
Features (1) Peak forward voltage: VFM = 0.
45 V (max)@IFM = 2.
0 A (2) Average forward current: IF(AV) = 2.
0 A (3) Repetitive peak reverse voltage: VRRM = 30 V (4) Small, thin package suitable for high-density board assembly Toshiba Nickname: M-FLATTM 3.
Packaging and Internal Circuit Pin Assignment CMS20I30A 3-4E1S 1: Anode 2: Cathode Start of commercial production 2010-10 1 2014-04-01 Rev.
2.
0 CMS20I30A 4.
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25) Characteristics Symbol Note Rating Unit Repetitive peak reverse voltage VRRM  30 V Average forward current IF(AV) (Note 1) 2.
0 A Non-repetitive peak forward surge current IFSM (Note 2) 30 Junction temperature Tj  150  Storage temperature Tstg -55 to 150 Note: Using continuously under heavy loads (e.
g.
the application of high temperature/current/voltage and the significant change in temperature, etc.
) may cause this product to decrease in the reliability significantly even if the operating conditions (i.
e.
operating temperature/current/voltage, etc.
) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.
e.
reliability test report and estimated failure rate, etc).
Note 1: Tℓ = 118 , square wave (α = 180°), VR = 15 V Note 2: f = 50 Hz, half-sine wave 5.
Thermal Characteristics Characteristics Thermal resistance (junction-to-ambient) Symbol Rth(j-a) Thermal resistance (junction-to-lead) Rth(j-ℓ) Note    Test Condition Max Device mounted on a ceramic board (soldering land size: 2 mm × 2 mm) Device mounted on a glass-epoxy board (soldering land size: 6 mm × 6 mm) Junction to cathode lead 60 135 16 6.
Electrical Characteristics (Un...


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