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GS8672D19BGE

GSI Technology
Part Number GS8672D19BGE
Manufacturer GSI Technology
Description 72Mb SigmaQuad-II+ Burst of 4 ECCRAM
Published Oct 13, 2016
Detailed Description GS8672D19/37BE-450/400/375/333/300 165-Bump BGA Commercial Temp Industrial Temp 72Mb SigmaQuadTM-II+ Burst of 4 ECCRAM...
Datasheet PDF File GS8672D19BGE PDF File

GS8672D19BGE
GS8672D19BGE

Overview
GS8672D19/37BE-450/400/375/333/300 165-Bump BGA Commercial Temp Industrial Temp 72Mb SigmaQuadTM-II+ Burst of 4 ECCRAMTM 450 MHz–300 MHz 1.
8 V VDD 1.
5 V I/O Features • 2.
0 Clock Latency • On-Chip ECC with virtually zero SER • Simultaneous Read and Write SigmaQuad™ Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface • Byte Write Capability due to ECC • Burst of 4 Read and Write • On-Die Termination (ODT) on Data (D), Byte Write (BW), and Clock (K, K) outputs • 1.
8 V +100/–100 mV core power supply • 1.
5 V HSTL Interface • Pipelined read operation • Fully coherent read and write pipelines • ZQ pin for programmable output drive strength • IEEE 1149.
1 JTAG-compliant Boundary Scan • Pin-compatible with 18Mb, 36Mb and 144Mb devices • 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package • RoHS-compliant 165-bump BGA package available SigmaQuad™ ECCRAM Overview The GS8672D19/37BE are built in compliance with the SigmaQuad-II+ ECCRAM pinout standard for Separate I...


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