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GS8342T18BGD

GSI Technology
Part Number GS8342T18BGD
Manufacturer GSI Technology
Description 36Mb SigmaDDR-II Burst of 2 SRAM
Published Oct 14, 2016
Detailed Description GS8342T08/09/18/36BD-400/350/333/300/250 165-Bump BGA Commercial Temp Industrial Temp 36Mb SigmaDDR-IITM Burst of 2 SR...
Datasheet PDF File GS8342T18BGD PDF File

GS8342T18BGD
GS8342T18BGD

Overview
GS8342T08/09/18/36BD-400/350/333/300/250 165-Bump BGA Commercial Temp Industrial Temp 36Mb SigmaDDR-IITM Burst of 2 SRAM 400 MHz–250 MHz 1.
8 V VDD 1.
8 V and 1.
5 V I/O Features • Simultaneous Read and Write SigmaDDR™ Interface • Common I/O bus • JEDEC-standard pinout and package • Double Data Rate interface • Byte Write (x36, x18 and x9) and Nybble Write (x8) function • Burst of 2 Read and Write • 1.
8 V +100/–100 mV core power supply • 1.
5 V or 1.
8 V HSTL Interface • Pipelined read operation with self-timed Late Write • Fully coherent read and write pipelines • ZQ pin for programmable output drive strength • IEEE 1149.
1 JTAG-compliant Boundary Scan • Pin-compatible with present 9Mb, 18Mb, 36Mb and 72Mb devices • 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package • RoHS-compliant 165-bump BGA package available SigmaDDR™ Family Overview The GS8342T08/09/18/36BD are built in compliance with the SigmaDDR-II SRAM pinout standard for Common I/O sync...


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