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MBRS340T3G

ON Semiconductor
Part Number MBRS340T3G
Manufacturer ON Semiconductor
Description Surface Mount Schottky Power Rectifier
Published Sep 27, 2017
Detailed Description DATA SHEET www.onsemi.com Surface Mount Schottky Power Rectifier MBRS320T3G, SBRS8320T3G, MBRS330T3G, NRVBS330T3G, MBRS...
Datasheet PDF File MBRS340T3G PDF File

MBRS340T3G
MBRS340T3G


Overview
DATA SHEET www.
onsemi.
com Surface Mount Schottky Power Rectifier MBRS320T3G, SBRS8320T3G, MBRS330T3G, NRVBS330T3G, MBRS340T3G, SBRS8340T3G SCHOTTKY BARRIER RECTIFIERS 3.
0 AMPERES 20, 30, 40 VOLTS These devices employ the Schottky Barrier principle in a large area metal-to-silicon power diode.
State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact.
Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system.
Features • Small Compact Surface Mountable Package with J-Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Very Low Forward Voltage Drop (0.
5 V Max @ 3.
0 A, TJ = 25°C) • Excellent Ability to Withstand Reverse Avalanche Energy Transients • Guard-Ring for Stress Protection • Device Passes ISO 7637 Pulse #1 • SBRS8 and NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Mechanical Characteristics • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 • Weight: 217 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max.
for 10 Seconds • Polarity: Polarity Band on Plastic Body Indicates Cathode Lead • Device Meets MSL 1 Requirements • ESD Ratings: ♦ Machine Model = C (> 400 V) ♦ Human Body Model = 3B (> 8000 V) SMC 2−LEAD CASE 403AC MARKING DIAGRAM AYWW B3xG G B3x = Device Code x = 2, 3 or 4 A = Assembly Location** Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) **The Assembly Location code (A) is front side optional.
In cases where the Assembly Location is stamped in the package, the front side assembly...



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