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EDB8164B3PF

ELPIDA
Part Number EDB8164B3PF
Manufacturer ELPIDA
Description 8G bits DDR2 Mobile RAM
Published Dec 3, 2017
Detailed Description DATA SHEET 8G bits DDR2 Mobile RAM™ PoP (12mm × 12mm, 216-ball FBGA) EDB8164B3PF Specifications • Density: 8G bits • O...
Datasheet PDF File EDB8164B3PF PDF File

EDB8164B3PF
EDB8164B3PF

Overview
DATA SHEET 8G bits DDR2 Mobile RAM™ PoP (12mm × 12mm, 216-ball FBGA) EDB8164B3PF Specifications • Density: 8G bits • Organization — 2 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Data rate: 1066Mbps (max.
) • Package: 216-ball FBGA — Package size: 12.
0mm × 12.
0mm — Ball pitch: 0.
4mm — Lead-free (RoHS compliant) and Halogen-free • Power supply — VDD1 = 1.
70V to 1.
95V — VDD2, VDDQ = 1.
14V to 1.
30V • Interface: HSUL_12 • Operating case temperature range — TC = -30°C to +85°C Features • JEDEC LPDDR2-S4B compliance • DLL is not implemented • Low power consumption • Mobile RAM functions — Partial Array Self-Refresh (PASR) — Auto Temperature Compensated Self-Refresh (ATCSR) by built-in temperature sensor — Deep power-down mode — Per Bank Refresh • This FBGA is suitable for Package on Package (PoP) Block Diagram VDD1 VDD2 VDDQ VREFCA_a, VREFCA_b VREFDQ_a, VREFDQ_b VSS CK_a, /CK_a CA0_a to...


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