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CM309

Part Number CM309
Manufacturer HITANO
Title CARBON FILM RESISTOR
Description CARBON FILM RESISTOR MELF & MINI-MELF CM, CML TYPE ■ Features ‧SMD enabled structure. ‧Conformal Multi-layer Coating Against Humidity ‧Lower curr...
Features ‧SMD enabled structure. ‧Conformal Multi-layer Coating Against Humidity ‧Lower current noise than thick film flat chip resistor ‧Excellent solderability.
■ Applications ‧Telecommunication ‧Automotive ‧Medical Equipment ‧Consumer Products
■ Construction and Dimension B L Body Color : Ivory Marking:...

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CM300DU-34KA : Powerex IGBTMOD™ Modules are designed for use in switching applications. Each module consists of two IGBT Transistors in a halfbridge configuration with each transistor having a reverseconnected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. Features: □ Low Drive Power □ Low VCE(sat) □ Discrete Super-Fast Recovery Free-Wheel Diode □ Isolated Baseplate for Easy Heat Sinking Millimeters 14.5 40.0 65.0 M8 6.5 Dia. 8.0 24.5 M4 15.0 9.0 26.0 20.0 Type CM Outline Drawing and Circuit Diagram Dimensions A B C D E F G H J K L M N Inches 5.51 5.12 5.12 1.38 4.33 4.33 0.39.

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CM300DX-24T : IGBT Modules CM300DX-24T/CM300DXP-24T HIGH POWER SWITCHING USE INSULATED TYPE Collector current IC . 3 0 0 A Collector-emitter voltage VCES 1 2 0 0 V Maximum junction temperature T v j m a x ... 1 7 5 °C DX ●Flat base type ●Copper base plate (Nickel-plating) ●RoHS Directive compliant DXP   ●Tin-plating pin terminals Collector current IC . 3 0 0 A Collector-emitter voltage VCES 1 2 0 0 V Maximum junction temperature T v j m a x ... 1 7 5 °C ●Flat base type ●Copper base plate (Nickel-plating) ●RoHS Directive compliant dual  switch  (half‐bridge)    ●Tin-plating pressfi.




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