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GS88237CB-xxxIV

GSI Technology
Part Number GS88237CB-xxxIV
Manufacturer GSI Technology
Description 9Mb SCD/DCD Sync Burst SRAM
Published May 29, 2019
Detailed Description GS88237CB-xxxIV 119-Bump BGA Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM 250 MHz–200 MHz 1.8 V or 2.5 V VDD...
Datasheet PDF File GS88237CB-xxxIV PDF File

GS88237CB-xxxIV
GS88237CB-xxxIV


Overview
GS88237CB-xxxIV 119-Bump BGA Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM 250 MHz–200 MHz 1.
8 V or 2.
5 V VDD 1.
8 V or 2.
5 V I/O Features • Single/Dual Cycle Deselect selectable • IEEE 1149.
1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.
8 V or 2.
5 V core power supply • 1.
8 V or 2.
5 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Default to Interleaved Pipeline mode • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 119-bump BGA package • RoHS-compliant 119-b...



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