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V3FL45

Vishay
Part Number V3FL45
Manufacturer Vishay
Description Surface Mount Trench MOS Barrier Schottky Rectifiers
Published Jul 10, 2019
Detailed Description www.vishay.com V3FL45 Vishay General Semiconductor Surface Mount Trench MOS Barrier Schottky Rectifiers TMBS® eSMP® S...
Datasheet PDF File V3FL45 PDF File

V3FL45
V3FL45

Overview
www.
vishay.
com V3FL45 Vishay General Semiconductor Surface Mount Trench MOS Barrier Schottky Rectifiers TMBS® eSMP® Series Top view Bottom view SMF (DO-219AB) Cathode Anode DESIGN SUPPORT TOOLS click logo to get started Models Available PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM 3.
0 A 45 V 50 A VF at IF = 2 A (TA = 125 °C) 0.
43 V TJ max.
Package 150 °C SMF (DO-219AB) Circuit configuration Single FEATURES • Trench MOS Schottky technology Available • Low profile package • Ideal for automated placement • Low forward voltage drop, low power losses • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Wave and reflow solderable • AEC-Q101 qualified available - Automotive ordering code: base P/NHM3 • Material categorization: for definitions of compliance please see www.
vishay.
com/doc?99912 TYPICAL APPLICATIONS For use in high frequency inverters, freewheeling, DC/DC converters, and polarity protection in commercial, industrial, and automotive applications.
MECHANICAL DATA Case: SMF (DO-219AB) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant Base P/NHM3 - halogen-free, RoHS-compliant, and AEC-Q101 qualified Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 and HM3 suffix meet JESD 201 class 2 whisker test Polarity: color band denotes the cathode end MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL V3FL45 Device marking code 3LE Maximum repetitive peak reverse voltage Maximum average forward rectified current (fig.
1) Peak forward surge current 8.
3 ms single half sine-wave superimposed on rated load Operating junction temperature range Storage temperature range VRRM IF(AV) (1) IF(AV) (2) IFSM TJ (3) TSTG 45 2.
5 3.
0 50 -40 to +150 -55 to +150 Notes (1) Free air, mounted on FR4 PCB, 2 oz.
standard footprint (2) Mounted on FR4 PCB, 2 oz.
10 mm x 10 mm copper pad area (3) The heat generated must be less than the thermal conductivi...


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