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TPS1100Y

Texas Instruments
Part Number TPS1100Y
Manufacturer Texas Instruments
Description SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS
Published Aug 19, 2019
Detailed Description TPS1100, TPS1100Y SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS D Low rDS(on) . . . 0.18 Ω Typ at VGS = – 10 V D 3 V Compat...
Datasheet PDF File TPS1100Y PDF File

TPS1100Y
TPS1100Y


Overview
TPS1100, TPS1100Y SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS D Low rDS(on) .
.
.
0.
18 Ω Typ at VGS = – 10 V D 3 V Compatible D Requires No External VCC D TTL and CMOS Compatible Inputs D VGS(th) = – 1.
5 V Max D Available in Ultrathin TSSOP Package (PW) D ESD Protection Up to 2 kV Per MIL-STD-883C, Method 3015 description The TPS1100 is a single P-channel enhancement-mode MOSFET.
The device has been optimized for 3-V or 5-V power distribution in battery-powered systems by means of Texas Instruments LinBiCMOS™ process.
With a maximum VGS(th) of – 1.
5 V and an IDSS of only 0.
5 µA, the TPS1100 is the ideal high-side switch for low-voltage, portable battery-management systems where maximizing battery life is a primary concern.
The low rDS(on) and excellent ac characteristics (rise time 10 ns typical) make the TPS1100 the logical choice for low-voltage switching applications such as power switches for pulse-width-modulated (PWM) controllers or motor/bridge drivers.
The ultrathin thin shrink small-outline package or TSSOP (PW) version with its smaller footprint and reduction in height fits in places where other P-channel MOSFETs cannot.
The size advantage is especially important where board real estate is at a premium and height restrictions do not allow for a small-outline integrated circuit (SOIC) package.
SLVS078C – DECEMBER 1993 – REVISED AUGUST 1995 D OR PW PACKAGE (TOP VIEW) SOURCE SOURCE SOURCE GATE 1 2 3 4 8 DRAIN 7 DRAIN 6 DRAIN 5 DRAIN D PACKAGE PW PACKAGE schematic SOURCE ESDProtection Circuitry GATE DRAIN NOTE A: For all applications, all source pins should be connected and all drain pins should be connected.
AVAILABLE OPTIONS PACKAGED DEVICES CHIP FORM TA SMALL OUTLINE PLASTIC DIP (Y) (D) (P) – 40°C to 85°C TPS1100D TPS1100PWLE TPS1100Y The D package is available taped and reeled.
Add an R suffix to device type (e.
g.
, TPS1100DR).
The PW package is available only left-end taped and reeled (indicated by the LE suffix on the device type; e.
g.
...



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