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TMP007

Texas Instruments
Part Number TMP007
Manufacturer Texas Instruments
Description Infrared Thermopile Sensor
Published Sep 6, 2019
Detailed Description Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMP007 SBOS685C – APRIL 2014 –...
Datasheet PDF File TMP007 PDF File

TMP007
TMP007

Overview
Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMP007 SBOS685C – APRIL 2014 – REVISED JULY 2015 TMP007 Infrared Thermopile Sensor with Integrated Math Engine 1 Features •1 Integrated MEMS Thermopile for Noncontact Temperature Sensing • 14-Bit Local Temperature Sensor for Cold Junction Reference – ±1°C (max) from 0°C to +60°C – ±1.
5°C (max) from –40°C to +125°C • Integrated Math Engine – Directly Read Object Temperature – Programmable Alerts – Nonvolatile Memory for Storing Calibration Coefficients – Transient Correction • Two-Wire Serial Interface Options – I2C and SMBus Compatible – Eight Programmable Addresses • Low Power – Supply: 2.
5 V to 5.
5 V – Active Current: 270 μA (typ) – 2-µA Shutdown (max) • Compact Package – 1.
9-mm × 1.
9-mm × 0.
625-mm DSBGA 2 Applications • Noncontact Temperature Sensing – Case Temperature – Laser Printers – Power Relays – Health and Beauty – HVAC Comfort Optimization • Gas Concentration • Flame Detection 3 Description The TMP007 is a fully-integrated microelectromechanical system (MEMS) thermopile sensor that measures the temperature of an object without direct contact.
The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.
The internal math engine combines the corresponding change in voltage across the thermopile with the internal cold-junction reference temperature sensor to calculate the target object temperature.
The TMP007 also provides nonvolatile memory for storing calibration coefficients.
The TMP007 is designed with portability and power in mind, and can easily be placed in the tightest of spaces while using standard surface-mount assembly processes.
Low power consumption also makes it well suited for battery-powered applications.
The TMP006 offers a reduced feature set.
The TMP006 offers similar performance as the TMP007, but does not contain the math engine or nonvolatile memory.
The Infrared the...


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