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ACURN105-HF

Comchip
Part Number ACURN105-HF
Manufacturer Comchip
Description SMD Ultra Fast Recovery Rectifiers
Published Dec 6, 2019
Detailed Description SMD Ultra Fast Recovery Rectifiers ACURN101-HF Thru. ACURN105-HF Forward current: 1.0A Reverse voltage: 200 to 1000V Ro...
Datasheet PDF File ACURN105-HF PDF File

ACURN105-HF
ACURN105-HF

Overview
SMD Ultra Fast Recovery Rectifiers ACURN101-HF Thru.
ACURN105-HF Forward current: 1.
0A Reverse voltage: 200 to 1000V RoHS Device Halogen Free Features - GPRC(Glass passivated rectifier chip) inside.
- Glass passivated cavity-free junction.
- Low power loss, High efficiency.
- High current capability - Plastic package has UL 94V-0.
- Comply with AEC-Q101 Mechanical Data - Case: Packed with FRP substrate and epoxy underfilled.
- Terminals: Pure Tin plated (Lead-Free),solderable per MIL-STD-750, method 2026.
- Polarity: Laser cathode band marking.
- Weight: 0.
012 grams(approx).
1206 0.
142(3.
60) 0.
126(3.
20) 0.
083(2.
10) 0.
067(1.
70) 0.
063(1.
60) Typ.
0.
035(0.
90) 0.
020(0.
50) 0.
046(1.
16) 0.
034(0.
86) R0.
016(0.
40) 0.
035(0.
90) 0.
020(0.
50) Dimensions in inches and (millimeter) Circuit Diagram Absolute Maximum Ratings (at TA=25°C unless otherwise noted) Parameter Repetitive peak reverse voltage Conditions Symbol ACURN 101-HF ACURN 102-HF ACURN 103-HF ACURN 104-HF ACURN 105-HF Units VRRM 200 400 600 800 1000 V Average forward current IF(AV) 1.
0 A Peak forward surge current 8.
3ms single half sine-wave IFSM 30 25 A Reverse recovery time IF=0.
5A,IR=1.
0A,Irr=0.
25A Trr 50 75 nS Operating junction temperature TJ -65 to +175 °C Storage temperature TSTG -65 to +175 °C Electrical Characteristics (at TA=25°C unless otherwise noted) Parameter Forward voltage IF =0.
1A IF =0.
5A IF =1.
0A Conditions Symbol VF Repetitive peak reverse current VR =Max.
VRRM, TA=25°C IRRM MIN.
- - TYP.
0.
98 1.
28 1.
45 0.
08 MAX.
1.
70 5 Junction capacitance VR =4V, f=1.
0MHZ CJ - 10 - Thermal Resistance Junction to ambient (Note) Junction to lead (Note) RθJA - 90 - RθJL - 40 - Notes: 1.
Thermal resistance from junction to ambient and from junction to lead P.
C.
B.
monuted on 0.
2×0.
2”(5.
0*5.
0mm) copper pad areas.
Company reserves the right to improve product design , functions and reliability without notice.
AQW-JU001 Comchip Technology CO.
, LTD.
Unit V uA pF ...


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