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SZNUP4301MR6

ON Semiconductor
Part Number SZNUP4301MR6
Manufacturer ON Semiconductor
Description Low Capacitance Diode
Published Jan 12, 2020
Detailed Description NUP4301MR6, SZNUP4301MR6 Low Capacitance Diode Array for ESD Protection in Four Data Lines SZ/NUP4301MR6T1G is a micro−...
Datasheet PDF File SZNUP4301MR6 PDF File

SZNUP4301MR6
SZNUP4301MR6

Overview
NUP4301MR6, SZNUP4301MR6 Low Capacitance Diode Array for ESD Protection in Four Data Lines SZ/NUP4301MR6T1G is a micro−integrated device designed to provide protection for sensitive components from possible harmful electrical transients; for example, ESD (electrostatic discharge).
Features • Low Capacitance (1.
5 pf Maximum Between I/O Lines) • Single Package Integration Design • Provides ESD Protection for JEDEC Standards JESD22 Machine Model = Class C Human Body Model = Class 3B • Protection for IEC61000−4−2 (Level 4) 8.
0 kV (Contact) 15 kV (Air) • Ensures Data Line Speed and Integrity • Fewer Components and Less Board Space • Direct the Transient to Either Positive Side or to the Ground • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • This is a Pb−Free Device* Applications • USB 1.
1 and 2.
0 Data Line Protection • T1/E1 Secondary IC Protection • T3/E3 Secondary IC Protection • HDSL, IDSL Secondary IC Protection • Video Line Protection • Microcontroller Input Protection • Base Stations • I2C Bus Protection http://onsemi.
com SC−74 CASE 318F PIN CONFIGURATION AND SCHEMATIC I/O 1 VN 2 1/O 3 6 I/O 5 VP 4 I/O MARKING DIAGRAM 64M G G 1 64 = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location.
*Date Code orientation may vary depending upon manufacturing location.
ORDERING INFORMATION Device Package NUP4301MR6T1G SC−74 (Pb−Free) SZNUP4301MR6T1G SC−74 (Pb−Free) Shipping† 3,000 / Tape & Reel 3,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014 September, 2014 − Rev.
7 1 ...


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