DatasheetsPDF.com

GMZ3.6 Datasheet PDF


Part Number GMZ3.6
Manufacturer PAN JIT
Title SURFACE MOUNT ZENER DIODES
Description GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES VOLTAGE 2 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Id...
Features
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA
• Case: Molded Glass MICRO-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight:...

File Size 325.10KB
Datasheet GMZ3.6 PDF File








Similar Ai Datasheet

GMZ10 : UPM GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range.

GMZ10 : GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES VOLTAGE 2 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.01 grams. • Polarity : Color band denotes cathode end • Packing information T/R - 2.5K per 7" plastic Reel 0.043(1.1) 0.040(1.0) 0.048(1.2)DIA. 0.008(0.2) 0.079(2.0) 0.071(1.8) 0.008(0.2) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Power Dissipation at TA= 25OC Symbol PTOT Operating J.

GMZ11 : GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES VOLTAGE 2 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.01 grams. • Polarity : Color band denotes cathode end • Packing information T/R - 2.5K per 7" plastic Reel 0.043(1.1) 0.040(1.0) 0.048(1.2)DIA. 0.008(0.2) 0.079(2.0) 0.071(1.8) 0.008(0.2) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Power Dissipation at TA= 25OC Symbol PTOT Operating J.

GMZ11 : UPM GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range.

GMZ12 : GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES VOLTAGE 2 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.01 grams. • Polarity : Color band denotes cathode end • Packing information T/R - 2.5K per 7" plastic Reel 0.043(1.1) 0.040(1.0) 0.048(1.2)DIA. 0.008(0.2) 0.079(2.0) 0.071(1.8) 0.008(0.2) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Power Dissipation at TA= 25OC Symbol PTOT Operating J.

GMZ12 : UPM GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range.

GMZ13 : GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES VOLTAGE 2 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.01 grams. • Polarity : Color band denotes cathode end • Packing information T/R - 2.5K per 7" plastic Reel 0.043(1.1) 0.040(1.0) 0.048(1.2)DIA. 0.008(0.2) 0.079(2.0) 0.071(1.8) 0.008(0.2) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Power Dissipation at TA= 25OC Symbol PTOT Operating J.

GMZ13 : UPM GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range.

GMZ15 : GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES VOLTAGE 2 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.01 grams. • Polarity : Color band denotes cathode end • Packing information T/R - 2.5K per 7" plastic Reel 0.043(1.1) 0.040(1.0) 0.048(1.2)DIA. 0.008(0.2) 0.079(2.0) 0.071(1.8) 0.008(0.2) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Power Dissipation at TA= 25OC Symbol PTOT Operating J.

GMZ15 : UPM GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range.

GMZ16 : GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES VOLTAGE 2 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.01 grams. • Polarity : Color band denotes cathode end • Packing information T/R - 2.5K per 7" plastic Reel 0.043(1.1) 0.040(1.0) 0.048(1.2)DIA. 0.008(0.2) 0.079(2.0) 0.071(1.8) 0.008(0.2) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Power Dissipation at TA= 25OC Symbol PTOT Operating J.

GMZ16 : UPM GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range.

GMZ18 : GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES VOLTAGE 2 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.01 grams. • Polarity : Color band denotes cathode end • Packing information T/R - 2.5K per 7" plastic Reel 0.043(1.1) 0.040(1.0) 0.048(1.2)DIA. 0.008(0.2) 0.079(2.0) 0.071(1.8) 0.008(0.2) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Power Dissipation at TA= 25OC Symbol PTOT Operating J.

GMZ18 : UPM GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range.

GMZ2.0 : UPM GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range.

GMZ2.0 : GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES VOLTAGE 2 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.01 grams. • Polarity : Color band denotes cathode end • Packing information T/R - 2.5K per 7" plastic Reel 0.043(1.1) 0.040(1.0) 0.048(1.2)DIA. 0.008(0.2) 0.079(2.0) 0.071(1.8) 0.008(0.2) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Power Dissipation at TA= 25OC Symbol PTOT Operating J.

GMZ2.2 : UPM GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range.




Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)