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W25M02GV

Part Number	W25M02GV
Manufacturer	Winbond
Description	3V 2G-BIT SERIAL SLC NAND FLASH MEMORY
Published	Mar 24, 2020
Detailed Description	W25M02GV Featuring 3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ ...
Datasheet	W25M02GV PDF File

Overview

W25M02GV Featuring 3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS Publication Release Date: May 09, 2018 Revision F W25M02GV Table of Contents 1.
GENERAL DESCRIPTIONS.
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6 2.
FEATURES 6 3.
PACKAGE TYPES AND PIN CONFIGURATIONS .
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7 3.
1 Pad Configuration WSON 8x6-mm .
7 3.
2 Pad Description WSON 8x6-mm 7 3.
3 Pin Configuration SOIC 300-mil .
8 3.
4 Pin Description SOIC 300-mil 8 3.
5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array).
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9 3.
6 Ball Description TFBGA 8x6-mm .
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9 4.
PIN DESCRIPTIONS .
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10 4.
1 Serial MCP (SpiStack®) Device Configuration .
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10 4.
2 Chip Select (/CS).
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10 4.
3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .
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10 4.
4 Write Protect (/WP)...

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