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FS820R08A6P2B

Infineon
Part Number FS820R08A6P2B
Manufacturer Infineon
Description Drive Module
Published Apr 11, 2020
Detailed Description HybridPACK™DriveModule FS820R08A6P2B FinalDataSheet V3.1,2019-10-10 AutomotiveHighPower FS820R08A6P2B HybridPACK...
Datasheet PDF File FS820R08A6P2B PDF File

FS820R08A6P2B
FS820R08A6P2B

Overview
HybridPACK™DriveModule FS820R08A6P2B FinalDataSheet V3.
1,2019-10-10 AutomotiveHighPower FS820R08A6P2B HybridPACK™DriveModule 1Features/Description HybridPACK™DrivemodulewithEDT2IGBTandDiode VCES = 750 V IC = 820 A T T T Typical Applications •Automotive Applications •Hybrid Electrical Vehicles (H)EV •Motor Drives •Commercial Agriculture Vehicles Electrical Features •Blocking voltage 750V •Low VCEsat •Low Switching Losses •Low Qg and Crss •Low Inductive Design •Tvj op = 150°C •Short-time extended Operation Temperature Tvj op = 175°C Mechanical Features •4.
2kV DC 1sec Insulation •High Creepage and Clearance Distances •Compact design •High Power Density •Direct Cooled PinFin Base Plate •Guiding elements for PCB and cooler assembly •Integrated NTC temperature sensor •PressFIT Contact Technology •RoHS compliant •UL 94 V0 module frame Product Name FS820R08A6P2B Description The HybridPACKTM Drive is a very compact six-pack module (750V/820A) optimized for hybrid and electric vehicles.
The power module implements the new EDT2 IGBT generation, which is an automotive Micro-Pattern Trench-Field-Stop cell design optimized for electric drive train applications.
The chipset has benchmark current density combined with short circuit ruggedness and increased blocking voltage for reliable inverter operation under harsh environmental conditions.
The EDT2 IGBTs also show excellent light load power losses, which helps to improve system efficiency over a real driving cycle.
The EDT2 IGBT was optimized for applications with switching frequencies in the range of 10 kHz.
The new HybridPACKTM Drive power module family comes with mechanical guiding elements supporting easy assembly processes for customers.
Furthermore, the press-fit pins for the signal terminals avoid additional time consuming selective solder processes, which provides cost savings on system level and increases system reliability.
The direct cooled baseplate with PinFin structure in the FS820R08A6P2...


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