DatasheetsPDF.com

V12PM15

Vishay
Part Number V12PM15
Manufacturer Vishay
Description Trench MOS Barrier Schottky Rectifier
Published May 4, 2020
Detailed Description www.vishay.com V12PM15 Vishay General Semiconductor High Current Density Surface-Mount TMBS® (Trench MOS Barrier Schot...
Datasheet PDF File V12PM15 PDF File

V12PM15
V12PM15

Overview
www.
vishay.
com V12PM15 Vishay General Semiconductor High Current Density Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier Ultra Low VF = 0.
60 V at IF = 6 A eSMP® Series K 1 2 SMPC (TO-277A) K Cathode Anode 1 Anode 2 ADDITIONAL RESOURCES 3D 3D 3D Models PRIMARY CHARACTERISTICS IF(AV) 12.
0 A VRRM 150 V IFSM VF at IF = 12.
0 A (TA = 125 °C) 200 A 0.
66 V TJ max.
175 °C Package SMPC (TO-277A) Circuit configuration Single FEATURES • Very low profile - typical height of 1.
1 mm Available • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified available - Automotive ordering code; base P/NHM3 • Material categorization: for definitions of compliance please see www.
vishay.
com/doc?99912 TYPICAL APPLICATIONS For use in low voltage high frequency inverters, freewheeling, DC/DC converters, and polarity protection applications.
MECHANICAL DATA Case: SMPC (TO-277A) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3 - halogen-free, RoHS-compliant, and AEC-Q101 qualified Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 and HM3 suffix meets JESD 201 class 2 whisker test MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL V12PM15 Device marking code 12M15 Maximum repetitive peak reverse voltage Maximum average forward rectified current (fig.
1) Peak forward surge current 10 ms single half sine-wave superimposed on rated load Operating junction temperature range Storage temperature range VRRM IF (1) IF (2) IFSM TJ (3) TSTG 150 12.
0 4.
7 200 -40 to +175 -55 to +175 Notes (1) Mounted on 30 mm x 30 mm pad areas aluminum PCB (2) Free air, mounted on recommended copper pad area (3) The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ <1/ RθJA UN...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)