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LMZ31506H

Texas Instruments
Part Number LMZ31506H
Manufacturer Texas Instruments
Description Power Module
Published Jun 2, 2020
Detailed Description Product Folder Order Now Technical Documents Tools & Software Support & Community LMZ31506H SNVS996B – JULY 2013 – ...
Datasheet PDF File LMZ31506H PDF File

LMZ31506H
LMZ31506H

Overview
Product Folder Order Now Technical Documents Tools & Software Support & Community LMZ31506H SNVS996B – JULY 2013 – REVISED APRIL 2018 LMZ31506H 6-A Power Module With 4.
5-V to 14.
5-V Input in QFN Package 1 Features •1 Complete Integrated Power Solution Allows Small Footprint, Low-Profile Design • 9-mm × 15-mm × 2.
8-mm package • Efficiencies Up To 96% • Wide-Output Voltage Adjust 1.
2 V to 5.
5 V, with 1% Reference Accuracy • Optional Split Power Rail allows Input Voltage Down to 1.
7 V • Adjustable Switching Frequency (480 kHz to 780 kHz) • Synchronizes to an External Clock • Adjustable Slow-Start • Output Voltage Sequencing and Tracking • Power Good Output • Programmable Undervoltage Lockout (UVLO) • Output Overcurrent Protection • Over Temperature Protection • Pre-bias Output Start-up • Operating Temperature Range: –40°C to +85°C • Enhanced Thermal Performance: 13°C/W • Meets EN55022 Class B Emissions - Integrated Shielded Inductor • Create a Custom Design Using the LMZ31506H With the WEBENCH® Power Designer 2 Applications • Broadband and Communications Infrastructure • Automated Test and Medical Equipment • Compact PCI / PCI Express / PXI Express • DSP and FPGA Point of Load Applications • High-Density Distributed Power Systems Efficiency 100 95 90 85 Efficiency (%) 80 75 70 65 VOUT = 3.
3 V fSW = 630 kHz 60 55 PVIN = VIN = 5 V PVIN = VIN = 12 V 50 0123456 Output Current (A) 1 3 Description The LMZ31506H power module is an easy-to-use integrated power solution that combines a 6-A DC-toDC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package.
This total power solution allows as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×15×2.
8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction ...


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