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LS-SP192DNB74-5

HSUKWANG
Part Number LS-SP192DNB74-5
Manufacturer HSUKWANG
Description Surface Mounted Chip LED
Published Jul 25, 2020
Detailed Description RoHS Pb Free Surface Mounted Chip LED Model No.:LS-SP192DNB74-5 █Features: ●Compatible with automatic placement equi...
Datasheet PDF File LS-SP192DNB74-5 PDF File

LS-SP192DNB74-5
LS-SP192DNB74-5



Overview
RoHS Pb Free Surface Mounted Chip LED Model No.
:LS-SP192DNB74-5 █Features: ●Compatible with automatic placement equipment ●Compatible with reflow solder process █Applications: ●Automotive_Telecommunication ●Indicators ●LCD Back-lights ●Illuminations Dice Material GaN Light Color Blue Absolute Maximum Ratings Item Power Dissipation Continuous Forward Current Peak Forward Current (1/10 Duty Cycle 0.
1ms Pulse Width) Reverse Voltage Derating Linear From 25℃ Operating Temperature Range Storage Temperature Range Symbol PD IF IFP VR Topr Tstg Electrical∕Optical Characteristics Item Symbol Condition Min.
Forward Voltage Reverse Current Peak Emission Wavelength Dominant Wavelength Viewing Angle VF IR λP λD 2θ1/2 IF=5mA VR=5V IF=5mA IF=5mA IF=5mA Luminous Intensity IV IF=5Ma 28.
5 Lens Color Water Clear (Ta=25℃) Maximum Unit 100 mW 25 mA 100 mA 5 0.
4 -30 to +80 -40 to +85 V mA/℃ ℃ ℃ (Ta=25℃) Typ.
Max.
Unit 2.
90 3.
20 V 10 uA 468 nm 470 nm 130 Deg 50 mcd ISSUE DIMENSION NO: APPROVAL: VERSION: B CHECK: DATE: 2009/05/25 EDIT: Page: 1 / 1 ◆Packing coding principle Notice: Bin code: luminous intensity / wavelength / voltage。 RoHS Pb Free Voltage code Wavelength code luminous intensity ◆The Luminous Intensity Grade of Blue Chip-LED Products ●Test Condition:@ 5 mA Range,mcd Bin code 28.
5/36 H1 36/45 H2 45/57 J1 57/72 J2 ◆ Dominant Wavelength Grade of Blue Chip-LED Products ●Ⅰtype @ 5mA BIN Range BIN 1 463.
5~466 4 2 466~468.
5 5 3 468.
5~471 Range 471~473.
5 473.
5~476 ◆ Forward Voltage Grade of Blue Chip-LED Products ●Ⅰtype @ 5mA BIN Range BIN 2 2.
7/2.
8 4 3 2.
8/2.
9 5 Range 2.
9~3.
0 3.
0~3.
1 Page: 2 / 2 RoHS Pb Free Descriptions: The Chip-LED Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
Besides, lightweight makes them ideal for miniature application, etc.
Reliabi...



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